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70V9159L6BF vs IDT70V9159L6BF feature comparison

70V9159L6BF Integrated Device Technology Inc

Buy Now Datasheet

IDT70V9159L6BF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100 10 X 10MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-100
Pin Count 100 100
Manufacturer Package Code BF100
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6.5 ns 15 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 100 MHz 100 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B100 S-PBGA-B100
JESD-609 Code e0 e0
Length 10 mm 10 mm
Memory Density 73728 bit 73728 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 9 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 100 100
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX9 8KX9
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA100,10X10,32 BGA100,10X10,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Standby Current-Max 0.003 A 0.003 A
Standby Voltage-Min 3 V 3 V
Supply Current-Max 0.33 mA 0.33 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 10 mm 10 mm
Base Number Matches 1 1
Memory » SRAMs
Memory » SRAMs

Compare 70V9159L6BF with alternatives

Compare IDT70V9159L6BF with alternatives