70V9159L6BF
vs
70V9159L6BFG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CABGA
Package Description
10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100
BGA,
Pin Count
100
Manufacturer Package Code
BF100
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
6.5 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
PIPELINED OR FLOW THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
JESD-30 Code
S-PBGA-B100
S-PBGA-B100
JESD-609 Code
e0
Length
10 mm
Memory Density
73728 bit
73728 bit
Memory IC Type
MULTI-PORT SRAM
DUAL-PORT SRAM
Memory Width
9
9
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
100
100
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX9
8KX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Equivalence Code
BGA100,10X10,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Standby Current-Max
0.003 A
Standby Voltage-Min
3 V
Supply Current-Max
0.33 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
10 mm
Base Number Matches
1
1
Compare 70V9159L6BF with alternatives
Compare 70V9159L6BFG with alternatives