70T9159L7BFI
vs
70V9159L7BFGI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CABGA
Package Description
BGA,
BGA,
Pin Count
100
Manufacturer Package Code
BF100
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7 ns
7.5 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
PIPELINED OR FLOW THROUGH ARCHITECTURE
JESD-30 Code
S-PBGA-B100
S-PBGA-B100
JESD-609 Code
e0
Memory Density
147456 bit
73728 bit
Memory IC Type
MULTI-PORT SRAM
DUAL-PORT SRAM
Memory Width
9
9
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
16384 words
8192 words
Number of Words Code
16000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16KX9
8KX9
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
2.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.4 V
3 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Compare 70T9159L7BFI with alternatives
Compare 70V9159L7BFGI8 with alternatives