70V9159L7BFGI8
vs
70V9159L6BFG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
BGA,
BGA,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
6.5 ns
Additional Feature
PIPELINED OR FLOW THROUGH ARCHITECTURE
PIPELINED OR FLOW THROUGH ARCHITECTURE
JESD-30 Code
S-PBGA-B100
S-PBGA-B100
Memory Density
73728 bit
73728 bit
Memory IC Type
DUAL-PORT SRAM
DUAL-PORT SRAM
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8KX9
8KX9
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Compare 70V9159L7BFGI8 with alternatives
Compare 70V9159L6BFG with alternatives