5962R9666501VEX vs HCC4504BF feature comparison

5962R9666501VEX Harris Semiconductor

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HCC4504BF STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR STMICROELECTRONICS
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Delay-Max 743 ns
Interface IC Type TTL/CMOS TO CMOS TRANSLATOR TTL/CMOS TO CMOS TRANSLATOR
JESD-30 Code R-CDIP-T16 R-GDIP-T16
Number of Bits 1 1
Number of Functions 6 6
Number of Terminals 16 16
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Latch or Register NONE NONE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 18 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16
Length 19.43 mm
Package Equivalence Code DIP16,.3
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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