5962R9666501VEX
vs
HCC4504BF
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
STMICROELECTRONICS
|
Package Description |
DIP,
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Delay-Max |
743 ns
|
|
Interface IC Type |
TTL/CMOS TO CMOS TRANSLATOR
|
TTL/CMOS TO CMOS TRANSLATOR
|
JESD-30 Code |
R-CDIP-T16
|
R-GDIP-T16
|
Number of Bits |
1
|
1
|
Number of Functions |
6
|
6
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Output Latch or Register |
NONE
|
NONE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
18 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Total Dose |
100k Rad(Si) V
|
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
16
|
Length |
|
19.43 mm
|
Package Equivalence Code |
|
DIP16,.3
|
Seated Height-Max |
|
5.08 mm
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare 5962R9666501VEX with alternatives
Compare HCC4504BF with alternatives