HCC4504BF
vs
CD4504BE
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Delay-Max |
|
|
| Interface IC Type |
TTL/CMOS TO CMOS TRANSLATOR
|
TTL/CMOS TO CMOS TRANSLATOR
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDIP-T16
|
| Length |
19.43 mm
|
|
| Number of Bits |
1
|
|
| Number of Functions |
6
|
|
| Number of Terminals |
16
|
16
|
| Output Latch or Register |
NONE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
5
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare HCC4504BF with alternatives