5962-9760701MXA
vs
TS68EN360MR1B/Q25L
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
ATMEL CORP
Part Package Code
PGA
PGA
Package Description
PGA,
PGA,
Pin Count
241
241
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
25 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CPGA-P241
S-CPGA-P241
JESD-609 Code
e0
e3
Low Power Mode
YES
YES
Number of Terminals
241
241
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Speed
25 MHz
25 MHz
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
PERPENDICULAR
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Length
47.245 mm
Seated Height-Max
4.96 mm
Terminal Pitch
2.54 mm
Width
47.245 mm
Compare 5962-9760701MXA with alternatives
Compare TS68EN360MR1B/Q25L with alternatives