TS68EN360MR1B/Q25L
vs
TS68EN360MRB/Q25L
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ATMEL CORP
ATMEL CORP
Part Package Code
PGA
PGA
Package Description
PGA,
PGA,
Pin Count
241
241
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
25 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CPGA-P241
S-CPGA-P241
JESD-609 Code
e3
e4
Length
47.245 mm
47.245 mm
Low Power Mode
YES
YES
Number of Terminals
241
241
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.96 mm
4.96 mm
Speed
25 MHz
25 MHz
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN
GOLD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
47.245 mm
47.245 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Compare TS68EN360MR1B/Q25L with alternatives
Compare TS68EN360MRB/Q25L with alternatives