5962-9690102HXA
vs
WSF512K32-27H2IA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
PGA
PGA
Package Description
PGA,
1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66
Pin Count
66
66
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
512K X 16 FLASH IS ALSO AVAILABLE
SRAM IS ORGANISED AS 512K X 32
JESD-30 Code
S-XPGA-P66
S-CPGA-P66
JESD-609 Code
e0
e0
Length
35.18 mm
35.2 mm
Memory Density
4194304 bit
16777216 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
512KX8
512KX32
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.66 mm
5.7 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
35.18 mm
35.2 mm
Base Number Matches
1
1
Rohs Code
Compare 5962-9690102HXA with alternatives
Compare WSF512K32-27H2IA with alternatives