WSF512K32-27H2IA
vs
WSE128K16-73G2TIA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
WHITE MICROELECTRONICS
Package Description
1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66
22.40 MM, CERAMIC, QFP-68
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
JESD-30 Code
S-CPGA-P66
S-CQFP-G68
JESD-609 Code
e0
Length
35.2 mm
Memory Density
16777216 bit
2097152 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
32
16
Mixed Memory Type
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
66
68
Number of Words
524288 words
131072 words
Number of Words Code
512000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX32
128KX16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
QFP
Package Equivalence Code
PGA66,11X11
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.7 mm
Standby Current-Max
0.09 A
Supply Current-Max
0.55 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
QUAD
Width
35.2 mm
Base Number Matches
3
3