5962-9318706HYC
vs
5962-3829429MZX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
AUSTIN SEMICONDUCTOR INC
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
25 ns
I/O Type
COMMON
JESD-30 Code
S-XPGA-P66
R-GDIP-T28
Memory Density
4194304 bit
65536 bit
Memory IC Type
SRAM MODULE
STANDARD SRAM
Memory Width
32
8
Number of Terminals
66
28
Number of Words
131072 words
8192 words
Number of Words Code
128000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX32
8KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
PGA
DIP
Package Equivalence Code
PGA66,11X11
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.0116 A
Standby Voltage-Min
2 V
Supply Current-Max
0.6 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
DUAL
Base Number Matches
5
3
Part Package Code
DIP
Package Description
DIP,
Pin Count
28
Number of Functions
1
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Compare 5962-9318706HYC with alternatives
Compare 5962-3829429MZX with alternatives