5962-3829429MZX
vs
WS512K32L-17G2TQ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
AUSTIN SEMICONDUCTOR INC
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
DIP
Package Description
DIP,
CERAMIC, QFP-68
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
17 ns
JESD-30 Code
R-GDIP-T28
S-CQMA-G68
Memory Density
65536 bit
16777216 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
28
68
Number of Words
8192 words
524288 words
Number of Words Code
8000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
512KX32
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QFP
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
QUAD
Base Number Matches
3
2
Rohs Code
Additional Feature
USER CONFIGURABLE AS 2M X 8
Alternate Memory Width
16
JESD-609 Code
e4
Screening Level
MIL-STD-883
Terminal Finish
GOLD
Compare 5962-3829429MZX with alternatives
Compare WS512K32L-17G2TQ with alternatives