5962-9314801Q2X vs 74AHC273BQ,115 feature comparison

5962-9314801Q2X QP Semiconductor

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74AHC273BQ,115 Nexperia

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Part Life Cycle Code Transferred Active
Ihs Manufacturer QP SEMICONDUCTOR INC NEXPERIA
Part Package Code QLCC QFN
Package Description QCCN, DHVQFN-20
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HOLD MODE
Family ABT AHC/VHC/H/U/V
JESD-30 Code S-CQCC-N20 R-PQCC-N20
Length 8.89 mm 4.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN HVQCCN
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd) 7.6 ns 21.5 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 1.905 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 8.89 mm 2.5 mm
fmax-Min 150 MHz 100 MHz
Base Number Matches 3 2
Rohs Code Yes
Manufacturer Package Code SOT764-1
Factory Lead Time 8 Weeks
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare 5962-9314801Q2X with alternatives

Compare 74AHC273BQ,115 with alternatives