5962-9309104HYC vs WE512K8200CQ feature comparison

5962-9309104HYC Mercury Systems Inc

Buy Now Datasheet

WE512K8200CQ Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer MERCURY SYSTEMS INC MICROSEMI CORP-PMG MICROELECTRONICS
Package Description DIP, DIP,
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 200 ns 200 ns
Additional Feature AUTOMATIC WRITE
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Length 42.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type EEPROM MODULE EEPROM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX8 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programming Voltage 5 V 5 V
Qualification Status Qualified Not Qualified
Screening Level MIL-PRF-38534 Class H MIL-STD-883
Seated Height-Max 6.98 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 4 1
Pbfree Code No
Part Package Code DIP
Pin Count 32
JESD-609 Code e4
Terminal Finish GOLD

Compare 5962-9309104HYC with alternatives

Compare WE512K8200CQ with alternatives