WE512K8200CQ vs FTE512S8N-20B feature comparison

WE512K8200CQ Microsemi Corporation

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FTE512S8N-20B Force Technologies Ltd

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSEMI CORP-PMG MICROELECTRONICS FORCE TECHNOLOGIES LTD
Part Package Code DIP DIP
Package Description DIP, DIP, DIP32,.6
Pin Count 32 32
Reach Compliance Code unknown compliant
Access Time-Max 200 ns 200 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
JESD-609 Code e4
Memory Density 4194304 bit 4194304 bit
Memory IC Type EEPROM MODULE EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX8 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.5 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Data Polling YES
Data Retention Time-Min 10
Endurance 10000 Write/Erase Cycles
Length 42.164 mm
Package Equivalence Code DIP32,.6
Page Size 128 words
Seated Height-Max 10.16 mm
Standby Current-Max 0.0012 A
Supply Current-Max 0.09 mA
Width 15.24 mm

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