Datasheets
WE512K8200CQ by:

512KX8 EEPROM 5V MODULE, 200ns, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32

Part Details for WE512K8200CQ by Microsemi Corporation

Overview of WE512K8200CQ by Microsemi Corporation

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Part Details for WE512K8200CQ

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WE512K8200CQ Part Data Attributes:

WE512K8200CQ Microsemi Corporation
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WE512K8200CQ Microsemi Corporation 512KX8 EEPROM 5V MODULE, 200ns, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP-PMG MICROELECTRONICS
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code unknown
Access Time-Max 200 ns
JESD-30 Code R-CDIP-T32
JESD-609 Code e4
Memory Density 4194304 bit
Memory IC Type EEPROM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V
Qualification Status Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish GOLD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for WE512K8200CQ

This table gives cross-reference parts and alternative options found for WE512K8200CQ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WE512K8200CQ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
XM28C040I-20 EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 Xicor Inc WE512K8200CQ vs XM28C040I-20
FTE512S8N-20M EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd WE512K8200CQ vs FTE512S8N-20M
XM28C040M-20 EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 Xicor Inc WE512K8200CQ vs XM28C040M-20
FTE512S8N-20B EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd WE512K8200CQ vs FTE512S8N-20B
WE512K8200CMA EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WE512K8200CQ vs WE512K8200CMA
WE512K8200CI EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc WE512K8200CQ vs WE512K8200CI
WE512K8200CQA EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WE512K8200CQ vs WE512K8200CQA
WE512K8200CI EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WE512K8200CQ vs WE512K8200CI
5962-9309105HYX EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 White Microelectronics WE512K8200CQ vs 5962-9309105HYX
5962-9309105HYA EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 White Microelectronics WE512K8200CQ vs 5962-9309105HYA
Part Number Description Manufacturer Compare
TC534000CP IC 512K X 8 MASK PROM, 120 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM Toshiba America Electronic Components WE512K8200CQ vs TC534000CP
M29F040-90CM Flash, 512KX8, 90ns, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Thales Group WE512K8200CQ vs M29F040-90CM
SST39SF040-70-4C-PHE Flash, 512KX8, 70ns, PDIP32, ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32 Silicon Storage Technology WE512K8200CQ vs SST39SF040-70-4C-PHE
M29F040B70P6T 512KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics WE512K8200CQ vs M29F040B70P6T
MR27V401D-XXRA MASK ROM, 512KX8, 80ns, CMOS, PDIP32, PLASTIC, DIP-32 OKI Electric Industry Co Ltd WE512K8200CQ vs MR27V401D-XXRA
FTE512S8N-25I 512KX8 EEPROM 5V, 250ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd WE512K8200CQ vs FTE512S8N-25I
M29F040-90CV Flash, 512KX8, 90ns, CDIP32 Thales Group WE512K8200CQ vs M29F040-90CV
AM29F004BT-55PC Flash, 512KX8, 55ns, PDIP32, PLASTIC, DIP-32 AMD WE512K8200CQ vs AM29F004BT-55PC
MR27V401ERA OTP ROM, 512KX8, 70ns, CMOS, PDIP32, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-32 OKI Electric Industry Co Ltd WE512K8200CQ vs MR27V401ERA
AM29F040B-150PF Flash, 512KX8, 150ns, PDIP32, LEAD FREE, PLASTIC, MO-015AP, DIP-32 AMD WE512K8200CQ vs AM29F040B-150PF

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