5962-9309104HXX by:

EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32

Part Details for 5962-9309104HXX by Mercury Systems Inc

Overview of 5962-9309104HXX by Mercury Systems Inc

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Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Part Details for 5962-9309104HXX

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5962-9309104HXX Part Data Attributes

5962-9309104HXX Mercury Systems Inc
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5962-9309104HXX Mercury Systems Inc EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
Part Life Cycle Code Active
Ihs Manufacturer MERCURY SYSTEMS INC
Package Description DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 200 ns
Additional Feature AUTOMATIC WRITE
JESD-30 Code R-CDIP-T32
Length 42.4 mm
Memory Density 4194304 bit
Memory IC Type EEPROM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 6.98 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for 5962-9309104HXX

This table gives cross-reference parts and alternative options found for 5962-9309104HXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9309104HXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
WE512K8200CMA Microsemi Corporation Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 5962-9309104HXX vs WE512K8200CMA
5962-9309105HYA White Microelectronics Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 5962-9309104HXX vs 5962-9309105HYA
AT28C040-20BISL703 Atmel Corporation Check for Price EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 5962-9309104HXX vs AT28C040-20BISL703
WE512K8200CM Mercury Systems Inc Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 5962-9309104HXX vs WE512K8200CM
5962-9309105HYX White Microelectronics Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 5962-9309104HXX vs 5962-9309105HYX
WE512K8-200CI Mercury Systems Inc Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DIP-32 5962-9309104HXX vs WE512K8-200CI
5962-9309104HXC White Electronic Designs Corp Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 5962-9309104HXX vs 5962-9309104HXC
WE512K8200CM Microsemi Corporation Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 5962-9309104HXX vs WE512K8200CM
Part Number Manufacturer Composite Price Description Compare
XM28C040-20 Xicor Inc Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 5962-9309104HXX vs XM28C040-20
5962-9309104HXX White Microelectronics Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 5962-9309104HXX vs 5962-9309104HXX
5962-9309104HXA White Microelectronics Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 5962-9309104HXX vs 5962-9309104HXA
AT28C040-20FJ Atmel Corporation Check for Price EEPROM, 512KX8, 200ns, Parallel, CMOS, CDFP32, CERAMIC, MO-115AA, FP-32 5962-9309104HXX vs AT28C040-20FJ
XM28C040MHR-20 Xicor Inc Check for Price EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 5962-9309104HXX vs XM28C040MHR-20
FTE256S8N-20B Force Technologies Ltd Check for Price EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 5962-9309104HXX vs FTE256S8N-20B
AT28C040-20BM/883 Microchip Technology Inc Check for Price EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32 5962-9309104HXX vs AT28C040-20BM/883
AT28C040-20BI Atmel Corporation Check for Price EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 5962-9309104HXX vs AT28C040-20BI
AT28C040-20FM Atmel Corporation Check for Price EEPROM, 512KX8, 200ns, Parallel, CMOS, CDFP32, BOTTOM BRAZED, CERAMIC, FP-32 5962-9309104HXX vs AT28C040-20FM
FTE512S8N-20C Force Technologies Ltd Check for Price EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 5962-9309104HXX vs FTE512S8N-20C

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