5962-9160401MEX
vs
CD74AC151M96
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
AC
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
Length
19.43 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
1
Number of Inputs
2
8
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
Output Polarity
INVERTED
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
3
4
Rohs Code
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.012 A
Package Equivalence Code
SOP16,.25
Packing Method
TR
Prop. Delay@Nom-Sup
20.9 ns
Terminal Finish
Tin/Lead (Sn/Pb)
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