5962-8984101LX
vs
5962-8753904KX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
TELEDYNE E2V (UK) LTD
Part Package Code
DIP
DFP
Package Description
DIP,
CERAMIC, FP-24
Pin Count
24
24
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
PAL WITH MACROCELLS; 10 MACROCELLS
Clock Frequency-Max
22 MHz
31 MHz
JESD-30 Code
R-GDIP-T24
R-GDFP-F24
JESD-609 Code
e0
Length
31.9405 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Programmable Logic Type
EE PLD
UV PLD
Propagation Delay
30 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Compare 5962-8984101LX with alternatives
Compare 5962-8753904KX with alternatives