5962-8753904KX
vs
5962-8984110LX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
QP SEMICONDUCTOR INC
Part Package Code
DFP
DIP
Package Description
DFP,
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
31 MHz
30.3 MHz
JESD-30 Code
R-GDFP-F24
R-GDIP-T24
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DFP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Programmable Logic Type
UV PLD
FLASH PLD
Propagation Delay
20 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
Compare 5962-8753904KX with alternatives
Compare 5962-8984110LX with alternatives