5962-8984101LX
vs
5962-8984101LA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
CERAMIC, DIP-24
Pin Count
24
24
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
22 MHz
22 MHz
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
30 ns
30 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
6
7
Rohs Code
Architecture
PAL-TYPE
JESD-609 Code
e0
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Package Equivalence Code
DIP24,.3
Screening Level
MIL-STD-883
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare 5962-8984101LX with alternatives
Compare 5962-8984101LA with alternatives