5962-8983914RA
vs
PALCE16V8Z-25PI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-20
PLASTIC, DIP-20
Pin Count
20
20
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
50 MHz
33.3 MHz
JESD-30 Code
R-GDIP-T20
R-PDIP-T20
JESD-609 Code
e0
e0
Number of Dedicated Inputs
8
8
Number of I/O Lines
8
8
Number of Inputs
18
18
Number of Outputs
8
8
Number of Product Terms
64
64
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8 DEDICATED INPUTS, 8 I/O
8 DEDICATED INPUTS, 8 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
15 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
Length
26.1366 mm
Seated Height-Max
4.953 mm
Width
7.62 mm
Compare 5962-8983914RA with alternatives
Compare PALCE16V8Z-25PI with alternatives