5962-8983914RA
vs
PALCE16V8Q-25PC/4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
VANTIS CORP
Part Package Code
DIP
Package Description
CERAMIC, DIP-20
PLASTIC, DIP-20
Pin Count
20
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
50 MHz
40 MHz
JESD-30 Code
R-GDIP-T20
R-PDIP-T20
JESD-609 Code
e0
e0
Number of Dedicated Inputs
8
10
Number of I/O Lines
8
8
Number of Inputs
18
18
Number of Outputs
8
8
Number of Product Terms
64
64
Number of Terminals
20
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
8 DEDICATED INPUTS, 8 I/O
10 DEDICATED INPUTS, 8 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
15 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
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