5962-8967101LA
vs
DAC8221EW
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
PRECISION MONOLITHICS INC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, GLASS SEALED, CERDIP-24
|
|
| Pin Count |
24
|
|
| Manufacturer Package Code |
Q-24-1
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
|
| JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.0122%
|
0.012%
|
| Number of Bits |
12
|
12
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
|
| Settling Time-Nom (tstl) |
0.45 µs
|
|
| Supply Current-Max |
2 mA
|
2 mA
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Settling Time-Max |
|
1 µs
|
|
|
|
Compare 5962-8967101LA with alternatives
Compare DAC8221EW with alternatives