5962-8959834MXA vs TC55V2001TR-10L feature comparison

5962-8959834MXA Microsemi Corporation

Buy Now Datasheet

TC55V2001TR-10L Toshiba America Electronic Components

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP TOSHIBA CORP
Part Package Code DIP TSOP1
Package Description DIP, 8 X 20 MM, 0.50 MM PITCH, REVERSE, PLASTIC, TSOP1-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 55 ns 100 ns
JESD-30 Code R-GDIP-T32 R-PDSO-G32
Length 40.64 mm 18.4 mm
Memory Density 1048576 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 128KX8 256KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSOP1-R
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 3.937 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 15.24 mm 8 mm
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare 5962-8959834MXA with alternatives

Compare TC55V2001TR-10L with alternatives