5962-8946202MYA
vs
HD68HC000PS-8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
HITACHI LTD
Package Description
DIP, DIP64,.9
SDIP, SDIP64,.75
Reach Compliance Code
unknown
unknown
Bit Size
32
16
JESD-30 Code
R-XDIP-T64
R-PDIP-T64
JESD-609 Code
e0
e0
Number of Terminals
64
64
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
SDIP
Package Equivalence Code
DIP64,.9
SDIP64,.75
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, SHRINK PITCH
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Speed
10 MHz
8 MHz
Supply Current-Max
45 mA
25 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
1.778 mm
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
6
2
Part Package Code
DIP
Pin Count
64
HTS Code
8542.31.00.01
Address Bus Width
24
Boundary Scan
NO
Clock Frequency-Max
8 MHz
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
NO
Length
57.6 mm
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
On Chip Data RAM Width
RAM (words)
0
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Width
19.05 mm
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