5962-8873302YC
vs
IDT7210L25F
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LOGIC DEVICES INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
LCC
|
QFP
|
Package Description |
QCCN, LCC68,.95SQ
|
QFF,
|
Pin Count |
68
|
64
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
|
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 40MHZ
|
Boundary Scan |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-CQCC-N68
|
S-CQFP-F64
|
JESD-609 Code |
e4
|
e0
|
Length |
24.1935 mm
|
22.86 mm
|
Low Power Mode |
NO
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
68
|
64
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Data Bus Width |
35
|
35
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
QFF
|
Package Equivalence Code |
LCC68,.95SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
3.048 mm
|
2.286 mm
|
Supply Current-Max |
25 mA
|
90 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
GOLD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.1935 mm
|
22.86 mm
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
Base Number Matches |
1
|
2
|
|
|
|
Compare 5962-8873302YC with alternatives
Compare IDT7210L25F with alternatives