5962-8863605KX
vs
M38510/20902BVA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
DFP
DIP
Package Description
DFP,
DIP,
Pin Count
24
18
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
12 ns
100 ns
JESD-30 Code
R-GDFP-F24
R-XDIP-T18
Memory Density
8192 bit
262144 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
18
Number of Words
1024 words
2048 words
Number of Words Code
1000
32000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
1KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DFP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-M-38510 Class B
Supply Current-Max
0.12 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
7
Compare 5962-8863605KX with alternatives
Compare M38510/20902BVA with alternatives