M38510/20902BVA
vs
5962-8765101KX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TELEDYNE E2V (UK) LTD
Part Package Code
DIP
DFP
Package Description
DIP,
DFP,
Pin Count
18
24
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
100 ns
55 ns
JESD-30 Code
R-XDIP-T18
R-GDFP-F24
Memory Density
262144 bit
1048576 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
18
24
Number of Words
2048 words
1024 words
Number of Words Code
32000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
128KX8
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
Supply Current-Max
0.03 mA
0.12 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
BIPOLAR
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Position
DUAL
DUAL
Base Number Matches
7
3
JESD-609 Code
e0
Length
15.367 mm
Seated Height-Max
2.286 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
9.652 mm
Compare M38510/20902BVA with alternatives
Compare 5962-8765101KX with alternatives