M38510/20902BVA
vs
63S841ANXXXX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
Pin Count
18
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
100 ns
JESD-30 Code
R-XDIP-T18
Memory Density
262144 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
18
Number of Words
2048 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Package Body Material
UNSPECIFIED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-M-38510 Class B
Supply Current-Max
0.03 mA
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
BIPOLAR
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Base Number Matches
7
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