5962-8850301PA
vs
MIC4424YWM-TR
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP,
|
SOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
NO
|
NO
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e3
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
TOTEM-POLE
|
|
| Output Peak Current Limit-Nom |
1.5 A
|
3 A
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
BICMOS
|
BCDMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Turn-off Time |
0.06 µs
|
0.1 µs
|
| Turn-on Time |
0.12 µs
|
0.1 µs
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
24 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Length |
|
10.338 mm
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
SOP16,.4
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
2.616 mm
|
| Supply Voltage-Max |
|
18 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
7.5945 mm
|
|
|
|
Compare 5962-8850301PA with alternatives
Compare MIC4424YWM-TR with alternatives