5962-8751508KA
vs
5962-8751506KX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
QP SEMICONDUCTOR INC
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
35 ns
55 ns
I/O Type
COMMON
JESD-30 Code
R-GDFP-F24
R-GDFP-F24
JESD-609 Code
e0
Length
15.367 mm
15.367 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDFP
WDFP
Package Equivalence Code
FL24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, WINDOW
FLATPACK, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.54 mm
2.54 mm
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
9.652 mm
9.652 mm
Base Number Matches
3
3
Package Description
WDFP,
Additional Feature
POWER SWITCHED PROM
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