5962-8751506KX
vs
CY7C263-25TMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Package Description
WDFP,
WINDOWED, CERPACK-24
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
55 ns
25 ns
Additional Feature
POWER SWITCHED PROM
POWER SWITCHED PROM
JESD-30 Code
R-GDFP-F24
R-GDFP-F24
Length
15.367 mm
15.367 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDFP
WDFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, WINDOW
FLATPACK, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
2.54 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
9.652 mm
9.652 mm
Base Number Matches
3
2
Rohs Code
Part Package Code
DFP
Pin Count
24
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
FL24,.4
Screening Level
MIL-STD-883
Standby Current-Max
0.05 A
Supply Current-Max
0.14 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare 5962-8751506KX with alternatives
Compare CY7C263-25TMB with alternatives