5962-86837012A
vs
54ALS32/BCAJC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Package Description
CERAMIC, LCC-20
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
Family
ALS
ALS
JESD-30 Code
S-CQCC-N20
R-GDIP-T14
JESD-609 Code
e0
e0
Length
8.89 mm
19.495 mm
Logic IC Type
NAND GATE
OR GATE
Number of Functions
1
4
Number of Inputs
8
2
Number of Terminals
20
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
QCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
15 ns
13 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
38535Q/M;38534H;883B
Seated Height-Max
2.03 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
8.89 mm
7.62 mm
Base Number Matches
3
3
Rohs Code
HTS Code
8542.39.00.01
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
4.9 mA
Prop. Delay@Nom-Sup
16 ns
Schmitt Trigger
NO
Compare 5962-86837012A with alternatives
Compare 54ALS32/BCAJC with alternatives