5962-86837012A
vs
74ALS32N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
CERAMIC, LCC-20
0.300 INCH, PLASTIC, DIP-14
Reach Compliance Code
unknown
unknown
Family
ALS
ALS
JESD-30 Code
S-CQCC-N20
R-PDIP-T14
JESD-609 Code
e0
Length
8.89 mm
19.025 mm
Logic IC Type
NAND GATE
OR GATE
Number of Functions
1
4
Number of Inputs
8
2
Number of Terminals
20
14
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
15 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
2.03 mm
4.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
8.89 mm
7.62 mm
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
14
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
Power Supply Current-Max (ICC)
4.9 mA
Compare 5962-86837012A with alternatives
Compare 74ALS32N with alternatives