Findchips: Compare 54QHSC157CS vs 54HSC157NB

54QHSC157CS vs 54HSC157NB feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	GEC PLESSEY SEMICONDUCTORS	GEC PLESSEY SEMICONDUCTORS
Package Description	DIP, DIP16,.3	,
Reach Compliance Code	unknown	unknown
Family	HSC	HSC
JESD-30 Code	R-CDIP-T16	X-XUUC-N
JESD-609 Code	e0
Length	20.58 mm
Logic IC Type	MULTIPLEXER	MULTIPLEXER
Max I(ol)	0.009 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Outputs	1	1
Number of Terminals	16
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Output Polarity	TRUE	TRUE
Package Body Material	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
Package Code	DIP	DIE
Package Equivalence Code	DIP16,.3	DIE OR CHIP
Package Shape	RECTANGULAR	UNSPECIFIED
Package Style	IN-LINE	UNCASED CHIP
Prop. Delay@Nom-Sup	25 ns
Propagation Delay (tpd)	25 ns	25 ns
Qualification Status	Not Qualified	Not Qualified
Screening Level	38535V;38534K;883S
Seated Height-Max	5.6 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Finish	Tin/Lead (Sn/Pb)
Terminal Form	THROUGH-HOLE	NO LEAD
Terminal Pitch	2.54 mm
Terminal Position	DUAL	UPPER
Total Dose	300k Rad(Si) V
Width	7.62 mm
Base Number Matches	2	1
HTS Code		8542.39.00.01
	Logic » Multiplexer/Demultiplexers	Logic » Multiplexer/Demultiplexers