54QHSC157CS
vs
54HHSC253LD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GEC PLESSEY SEMICONDUCTORS
GEC PLESSEY SEMICONDUCTORS
Package Description
DIP, DIP16,.3
,
Reach Compliance Code
unknown
unknown
Family
HSC
HSC
JESD-30 Code
R-CDIP-T16
S-CQCC-N20
JESD-609 Code
e0
Length
20.58 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.009 A
Number of Functions
4
2
Number of Inputs
2
4
Number of Outputs
1
1
Number of Terminals
16
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP16,.3
LCC20,.35SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Prop. Delay@Nom-Sup
25 ns
Propagation Delay (tpd)
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535V;38534K;883S
Seated Height-Max
5.6 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
QUAD
Total Dose
300k Rad(Si) V
Width
7.62 mm
Base Number Matches
2
1
HTS Code
8542.39.00.01
Output Characteristics
3-STATE
Compare 54QHSC157CS with alternatives
Compare 54HHSC253LD with alternatives