54HSC157NB
vs
54QHSC253FS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GEC PLESSEY SEMICONDUCTORS
GEC PLESSEY SEMICONDUCTORS
Package Description
,
DFP, FL16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HSC
HSC
JESD-30 Code
X-XUUC-N
R-CDFP-F16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
2
Number of Inputs
2
4
Number of Outputs
1
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
DFP
Package Equivalence Code
DIE OR CHIP
FL16,.3
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
FLATPACK
Propagation Delay (tpd)
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
FLAT
Terminal Position
UPPER
DUAL
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Length
10.16 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.009 A
Number of Terminals
16
Output Characteristics
3-STATE
Prop. Delay@Nom-Sup
25 ns
Screening Level
38535V;38534K;883S
Seated Height-Max
2.61 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
1.27 mm
Total Dose
300k Rad(Si) V
Width
6.85 mm
Compare 54HSC157NB with alternatives
Compare 54QHSC253FS with alternatives