26LS31/BEA vs LTC486CN#PBF feature comparison

26LS31/BEA NXP Semiconductors

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LTC486CN#PBF Linear Technology

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS LINEAR TECHNOLOGY CORP
Part Package Code DIP DIP
Package Description CERAMIC, DIP-16 0.300 INCH, PLASTIC, LEAD FREE, DIP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 1 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; EIA-485
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Length 19.535 mm
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 3.81 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Transmit Delay-Max 30 ns 50 ns
Width 7.62 mm 7.62 mm
Base Number Matches 4 2
Rohs Code Yes
Manufacturer Package Code N
JESD-609 Code e3
Moisture Sensitivity Level 1
Out Swing-Min 1.5 V
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) 260
Receive Delay-Max
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare 26LS31/BEA with alternatives

Compare LTC486CN#PBF with alternatives