26LS31/BEA vs FIN1048MTC feature comparison

26LS31/BEA NXP Semiconductors

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FIN1048MTC Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIP TSSOP
Package Description CERAMIC, DIP-16 4.40 MM, MO-153, TSSOP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Differential Output YES
Driver Number of Bits 1
Input Characteristics STANDARD DIFFERENTIAL
Interface IC Type LINE DRIVER LINE RECEIVER
Interface Standard EIA-422; FED STD 1020 EIA-644; TIA-644
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Length 19.535 mm 5 mm
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 5.08 mm 1.2 mm
Supply Voltage-Max 5.5 V 3.6 V
Supply Voltage-Min 4.5 V 3 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount NO YES
Technology TTL
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Transmit Delay-Max 30 ns
Width 7.62 mm 4.4 mm
Base Number Matches 4 3
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Receive Delay-Max 2.5 ns
Receiver Number of Bits 4
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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