2308A-1HDCI vs MC100EP210SFA feature comparison

2308A-1HDCI Integrated Device Technology Inc

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MC100EP210SFA onsemi

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ON SEMICONDUCTOR
Part Package Code SOIC QFP
Package Description SOP, SOP16,.25 LQFP, QFP32,.35SQ,32
Pin Count 16 32
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 2308 100E
Input Conditioning STANDARD DIFFERENTIAL
JESD-30 Code R-PDSO-G16 S-PQFP-G32
JESD-609 Code e0 e0
Length 9.9314 mm 7 mm
Logic IC Type PLL BASED CLOCK DRIVER LOW SKEW CLOCK DRIVER
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Number of Functions 1 2
Number of Inverted Outputs
Number of Terminals 16 32
Number of True Outputs 8 5
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP LQFP
Package Equivalence Code SOP16,.25 QFP32,.35SQ,32
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 240 235
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.2 ns 0.025 ns
Seated Height-Max 1.7272 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 2.625 V
Supply Voltage-Min (Vsup) 3 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn80Pb20)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.937 mm 7 mm
fmax-Min 133.3 MHz
Base Number Matches 1 1
Pbfree Code No
Prop. Delay@Nom-Sup 0.675 ns
Propagation Delay (tpd) 0.65 ns
Technology ECL

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