1N966C
vs
JANHCA1N966C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
MICROCHIP TECHNOLOGY INC
Package Description
O-LALF-W2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
17 Ω
JEDEC-95 Code
DO-204AH
JESD-30 Code
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
UNCASED CHIP
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
1 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
16 V
8.2 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
Terminal Position
AXIAL
UNSPECIFIED
Voltage Tol-Max
2%
2%
Working Test Current
7.8 mA
31 mA
Base Number Matches
5
1
Category CO2 Kg
8.7
Candidate List Date
2020-06-25
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Qualifications
DLA, Rad Hard
Reference Standard
MIL-19500/115K
Compare 1N966C with alternatives
Compare JANHCA1N966C with alternatives