1N8164US
vs
TGL34-36A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
DIOTEC SEMICONDUCTOR AG
Package Description
MELF-2
ROHS COMPLIANT, PLASTIC, MINIMELF-2
Reach Compliance Code
compliant
not_compliant
Factory Lead Time
21 Weeks
Additional Feature
HIGH RELIABILITY
Breakdown Voltage-Min
34.2 V
34.2 V
Case Connection
ISOLATED
ISOLATED
Clamping Voltage-Max
49.9 V
49.9 V
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
O-LELF-R2
O-PELF-R2
Non-rep Peak Rev Power Dis-Max
150 W
150 W
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
150 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Reference Standard
IEC-61000-4-2, 4-4
Rep Pk Reverse Voltage-Max
30 V
30.8 V
Surface Mount
YES
YES
Technology
AVALANCHE
AVALANCHE
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
7
1
Pbfree Code
Part Package Code
DO-213AA
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
Diotec
Breakdown Voltage-Max
37.8 V
Breakdown Voltage-Nom
36 V
JEDEC-95 Code
DO-213AA
JESD-609 Code
e1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
5
Compare 1N8164US with alternatives
Compare TGL34-36A with alternatives