1N6641U vs JANS1N6641US feature comparison

1N6641U Cobham Semiconductor Solutions

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JANS1N6641US Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer AEROFLEX/METELICS INC MICROCHIP TECHNOLOGY INC
Package Description O-LALF-W2 SURFACE MOUNT PACKAGE-2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.70
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-LALF-W2 O-XELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Output Current-Max 0.3 A 0.3 A
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Qualified
Rep Pk Reverse Voltage-Max 50 V
Reverse Recovery Time-Max 0.005 µs 0.005 µs
Surface Mount NO YES
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Base Number Matches 10 1
Rohs Code No
Factory Lead Time 32 Weeks
Additional Feature METALLURGICALLY BONDED
Application GENERAL PURPOSE
Forward Voltage-Max (VF) 1.1 V
Non-rep Pk Forward Current-Max 2.5 A
Number of Phases 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reference Standard MIL-19500/609D
Reverse Current-Max 0.1 µA

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