1N4102UR
vs
JANTXV1N4102UR-1
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS, MLL34, MELF-2
|
DO-213AA, 2 PIN
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
14 Weeks
|
20 Weeks
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
200 Ω
|
200 Ω
|
JEDEC-95 Code |
DO-213AA
|
DO-213AA
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
200 °C
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Voltage-Nom |
8.7 V
|
8.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
0.25 mA
|
0.25 mA
|
Base Number Matches |
9
|
1
|
Operating Temperature-Min |
|
-65 °C
|
Reference Standard |
|
MIL-19500/435F
|
Reverse Current-Max |
|
1 µA
|
Voltage Temp Coeff-Max |
|
4.263 mV/°C
|
|
|
|
Compare 1N4102UR with alternatives
Compare JANTXV1N4102UR-1 with alternatives