1N2809RBE3
vs
1N3310B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
TO-3
Package Description
O-MBFM-P2
HERMETIC SEALED, METAL, DO-5, 1 PIN
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
CATHODE
ANODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
0.8 Ω
JEDEC-95 Code
TO-204AD
DO-203AB
JESD-30 Code
O-MBFM-P2
O-MUPM-D1
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
FLANGE MOUNT
POST/STUD MOUNT
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
50 W
50 W
Reference Voltage-Nom
11 V
11 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
PIN/PEG
SOLDER LUG
Terminal Position
BOTTOM
UPPER
Voltage Tol-Max
5%
5%
Working Test Current
1100 mA
1100 mA
Base Number Matches
1
4
Factory Lead Time
35 Weeks
Category CO2 Kg
8.7
Candidate List Date
2020-06-25
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Additional Feature
HIGH RELIABILITY, LOW IMPEDANCE
Qualification Status
Not Qualified
Compare 1N2809RBE3 with alternatives
Compare 1N3310B with alternatives