10H515/BFAJC
vs
MC10H116MR2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
DFP
|
SOIC
|
| Package Description |
DFP, FL16,.3
|
SOP, SOP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
R-GDFP-F16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
9.65 mm
|
10.2 mm
|
| Number of Functions |
4
|
3
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
SOP
|
| Package Equivalence Code |
FL16,.3
|
SOP16,.23
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
1.8 ns
|
1.45 ns
|
| Receiver Number of Bits |
4
|
3
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
2.15 mm
|
2.05 mm
|
| Supply Current-Max |
29 mA
|
23 mA
|
| Supply Voltage-Nom |
2 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.415 mm
|
5.275 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Differential Output |
|
YES
|
| High Level Input Current-Max |
|
0.000095 A
|
|
|
|
Compare 10H515/BFAJC with alternatives
Compare MC10H116MR2 with alternatives