10132F
vs
5962-87793012X
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SRI INTERNATIONAL
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
TWO 2:1 MUX FOLLOWED BY LATCH
|
|
| Family |
10K
|
10K
|
| JESD-30 Code |
R-GDIP-T16
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Number of Bits |
2
|
6
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-30 °C
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
55 mA
|
|
| Prop. Delay@Nom-Sup |
6.3 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
| Base Number Matches |
4
|
3
|
| Package Description |
|
QCCN,
|
| Length |
|
8.885 mm
|
| Propagation Delay (tpd) |
|
5.3 ns
|
| Seated Height-Max |
|
1.9 mm
|
| Width |
|
8.885 mm
|
| fmax-Min |
|
125 MHz
|
|
|
|
Compare 10132F with alternatives
Compare 5962-87793012X with alternatives