100331WFQMLV
vs
100150Y
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
PHILIPS COMPONENTS
|
| Package Description |
QFF, QFL24,.4SQ
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100K
|
100K
|
| JESD-30 Code |
S-GQFP-F24
|
S-CQFP-F24
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Max Frequency@Nom-Sup |
400000000 Hz
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
6
|
| Number of Functions |
3
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
QFP
|
| Package Equivalence Code |
QFL24,.4SQ
|
QFL24,.4SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
130 mA
|
|
| Prop. Delay@Nom-Sup |
2.5 ns
|
|
| Propagation Delay (tpd) |
2.4 ns
|
1.85 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
|
| Seated Height-Max |
2.159 mm
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Trigger Type |
POSITIVE EDGE
|
LOW LEVEL
|
| fmax-Min |
400 MHz
|
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
WITH DUAL LATCH ENABLE
|
| Output Characteristics |
|
OPEN-EMITTER
|
|
|
|
Compare 100331WFQMLV with alternatives
Compare 100150Y with alternatives