100325DMQB
vs
100125DC
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP24,.4
|
DIP, DIP24,.4
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Delay-Max |
5.7 ns
|
4 ns
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
ECL TO TTL TRANSLATOR
|
ECL TO TTL TRANSLATOR
|
| JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Number of Bits |
1
|
1
|
| Number of Functions |
6
|
6
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
TOTEM-POLE
|
TOTEM-POLE
|
| Output Latch or Register |
NONE
|
NONE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.4
|
DIP24,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.72 mm
|
5.72 mm
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
10.16 mm
|
| Base Number Matches |
5
|
3
|
| Supply Current-Max |
|
115 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Supply Voltage1-Max |
|
-5.7 V
|
| Supply Voltage1-Min |
|
-4.2 V
|
| Supply Voltage1-Nom |
|
-5 V
|
|
|
|
Compare 100325DMQB with alternatives
Compare 100125DC with alternatives